| 1. | Set up an ultrasonic wire bonding laboratory
成立超声波电子焊接实验室 |
| 2. | Wire bond parameter optimization in semiconductor assembly
半导体封装超声波压焊的工艺参数优化 |
| 3. | Application of statistical process control in wire bonding
现场总线技术在烧碱蒸发工艺中的应用 |
| 4. | Automatic encapsulating auto - wire bonding machine
自动分光机 |
| 5. | Standard practice for nondestructive pull testing of wire bonds
金属丝连接的非破坏性抗拉试验的标准实施规范 |
| 6. | Ultrasonic wire bonding
超声波线焊 |
| 7. | Standard test methods for measuring pull strength of microelectronic wire bonds
微电子器件金属丝连接抗拉强度测量的标准试验方法 |
| 8. | Test method for adhesion strength of bondable films to substrates in ribbon - wire bonds
绑线连接时可粘性膜同衬底的粘结强度的试验方法 |
| 9. | Wire bonded chip
线焊芯片 |
| 10. | With the development of mems industry , a higher request for automation wire bonding is put forward
随着mems技术逐渐进入产业化发展阶段,对引线键合的自动化和批量化提出了更高的要求。 |
